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中国国际半导体技术大会(CSTIC) 2017

China Semiconductor Technology International Conference (CSTIC) 2017

Plan now to participate at CSTIC 2017, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and  IEEE-EDS , co-organized by IMEC and ICMTIA(The Integrated circuit Materials Industry Technology Innovation Alliance), and co-sponsored by ECS, MRS and CEMIA(the China Electronics Materials Industry Association), CSTIC 2017 will be held March 12-13, 2017 in Shanghai, China, in conjunction with SEMICON China 2017. The conference will have ten symposia cover all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detail manufacturing processes, devices design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as memory technology, 3D integration, MEMS and Photovoltaic Technology will also be addressed in the conference.

**Full length manuscripts of accepted papers will be considered for publication in IEEE Xplore.

Date and Venue

March 12-13, 2017
Shanghai International Convention Center
上海国际会议中心 中国上海浦东滨江大道2727号
No.2727 Riverside Avenue Pudong, Shanghai 200120, China


Distinguished Conference Keynote Speakers

 Prof. Hiroshi Amano   Prof. Rao Tummala Dr. Jong Shik Yoon  
Nobel Laureate in Physics, 2014
Director, Center for Integrated Research of Future Electronics, Institute of Materials and Systems for Sustainability, Nagoya University
  Joseph.M Pettit Chair Professor in ECE and MSE
Director, 3D Microsystems Packaging Research Center
Georgia Research Alliance Eminent Scholar
Georgia Institute of Technology, Atlanta,  Ga, USA

Executive Vice President  Foundry Business System-LSI,Samsung Electronics Co,LTD,Korea


Conference Chairman

Dr. David Huang
Pall Corporation, USA













 Proceedings  Publication:       


Partial list of other confirmed distinguished CSTIC 2017 invited speakers

Conference Programs 

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV:Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Circuit Design, Systems and Applications

Si Materials and Photovoltaic Technology (Detail conference information please refer to the link)    

Contact Us

Kelly Zhang, SEMI China
Tel: 86.21.6027.8556
Fax: 86.21.6027.8511