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Committee Members

International Advisory Committee Members

Dr. T. C. Chen
Chairman
IBM Fellow and VP, IBM T.J. Watson Research Center, USA

 

 

Dr. Minhwa Chi
Co-Chair
Senior VP, SMIC

 

 

Dr. Philip Wong
Co-Chair
Stanford University, USA

 

Dr. Swami Mathad
Co-Chair
Tech Consulting, USA

 

 

Dr. Georg Bednorz
Member
IBM Fellow, Nobel Laureate, Switzerland

 

 

Dr. Qingyuan Han
Member
Hans Consulting International, USA

 

 

Dr. Kinam KIM
Member
President and CEO, Samsung Institute of Advanced Technology, Korea

 

 

Mrs. Ying Shi
Member
ICMTIA, China

 

 

Dr. Hsing-Huang Tseng
Member
Texas State University

 

 

Dr. Hailing Tu
Member
GRINM, China

 

 

Dr. Shichang Zou
Member
Chinese Academy of Sciences, China

 

 

Dr. Edward Y. Chang

Member

National Chiao Tung University, Taiwan, China

  

Steering Committee Advisors

Dr. Roque Calvo
ECS Representative
ECS
  
Lung Chu
President
SEMI China
  
Dr. Hiroshi IWai
Member
Tokyo Institute of Technology, Japan
  
Dr. Tomi T. Li
Member
National Taiwan Central University

Conference Chair and Co- Chairs

Dr.David Huang
Chairman
Pall Inc. USA

 
  
Dr. Cor Claeys
Co-Chair
IMEC, Belgium
  
Dr. Hanming Wu
Co-Chair
SMIC, China
  
 Dr. Qinghuang Lin
Co-Chair
IBM, USA
  
Dr. Ru Huang
Co-Chair
Peking University, China
  
Dr. Steve Liang
Co-Chair
Jiangsu Changjiang Electronics Technology Co., Ltd, China
  
Mrs. Ying Shi
Co-Chair
ICMTIA, China
  
Dr. Yue Kuo
ECS Representative
Texas A&M University, USA

 

Symposium Chair:

Dr. Ru Huang
Chairwoman
Peking University, China

  

Dr. Kafai Lai
Chairman
IBM, USA

 

  

Dr. Ying ZHANG
Chairman
Applied Materials, USA

  

Mr. Zhen Guo

Chairman
Intel, China

  

Dr. Yuchun Wang

Chairman
Anji Microelectronics, China

  

Dr. Peilin Song
Chairman
IBM, USA
  

Dr. Steve Liang
Chairman
Jiangsu Changjiang Electronics Technology Co., Ltd, China

  

Dr. Qinghuang Lin
Chairman
IBM, USA

  

Dr. Yiyu Shi
Chairman
Missouri University of Science and Technolog, USA

  

Prof. Frank  Liu

Chairman
Shanxi Normal University, China

Symposium I: Device Engineering and Technology

Dr. Ru Huang
Chairwoman
Peking University, China
  
Dr. Cor Claeys
Co-Chair
IMEC, Belgium
  
Dr. Minhwa Chi
Co-Chair
Senior VP, SMIC
  
 Dr. Ming Liu
Co-Chair
IME, CAS, China
  
Dr. Chung Lam
Co-Chair
Principle Engineer, IBM, USA
  
 

Dr. Fred Chen
Member
Industrial Technology Research Institute, Taiwan

  
 Prof. Jong-Ho Lee
Member
Seoul National University, Korea
  
Dr. Shaoning Mei
Member
Wuhan Xinxin Semiconductor Manufacturing Corp
  
 

Dr. Wensheng Qian
Member
Director, HHGrace

  
 

Dr. Huiling Shang
Member
TSMC

  

Dr. Hong Wu
Member
SMIC, China

  

Dr. Huaqiang Wu
Member
Microelectronics, Tsinghua University, Beijing, China

  

Dr. Frank Bin Yang
Member
Qualcomm, USA

 

  

Dr. Huilong Zhu
Member
IME, CAS, China

Symposium II: Lithography and Patterning

Dr. Kafai Lai
Chairman
IBM, USA

  
 

Dr. Ken Wu
Co-Chair
SMIC, China

  

Dr. Linyong (Leo) Pang
Co-Chair
VP. D2S Inc.

  

Mr. Ma Xiaoming
Member
Dow Chemical

  
 

Dr. Zhimin Zhu
Member
Brewer Science, USA

  
 

Dr. Zhibiao Mao
Member
Huali Semiconductor Manufacturing Company, China

  
 

Dr. Yayi Wei
Member
Chinese Academy of Science

  

Motokatsu.Imai
Member
SEAJ (Semiconductor Equipment Association of Japan)


 


Shiyuan Liu
Member
Huazhong University of Science and Technology , China




Hai Deng 
Member
Fudan University,China

Symposium III: Dry &Wet Etch and Cleaning

Dr. Ying ZHANG
Chairman
VP,
Applied Material, USA
  
Dr. Maxime Darnon
Co-Chair
French Institute for Scientific Research (CNRS), France
  
Dr. Yue Kuo
Co-Chair
Texas A&M University, USA
  
 Dr. Tom Ni
Member
AMEC, China
  
Mr. Jinrong Zhao
Member
North Microelectronics, China
  
Dr. Sebastian Engelmann
Member
IBM T.J.Watson Research Center, USA
  
Dr. George Totir
Member
IBM T.J.Watson Research Center, USA
  
Dr. Masahiro Sumiya
Member
Hitachi High-Technologies Corp., Japan
  
Dr. Denis Shamiryan
Member
Global Foundries, USA
  
  
 Dr. Steven Zhang
Member
SMIC, China
  
 Dr. Kaidong Xu
Member
IMEC, Belgium

Symposium IV: Thin film, Plating and Process Integration

Dr. Zhen Guo
Chairman
Intel, China
  
 Dr. Beichao Zhang
Co-Chair
SMIC, China
  
 Mr. Xiaoping Shi
Co-Chair
IMEC, Belgium
  
 Dr. Chao Zhao
Co-Chair
IME, CAS, China
  
 Dr. Huang Liu
Co-Chair
Global Foundries, USA
  
Dr. Jiang Yan
Co-Chair
Institute of Microelectronics, CAS
  
Dr. Ran Liu
Co-Chair
Fudan University, China
  
Dr. Sowmya Krishnan
Co-Chair
SEMITRAC, USA
  
Dr. Jason Tian
Member
Nikon Precision, China
  
Dr. Jon REID
Member
Novellus, USA
  
Prof. Yu-Long Jiang
Member
Fudan University, Shanghai
  
Dr. Li-Qun Xia
Member
AMAT, USA
  
Dr. Julian Hsieh
Member
ASM, Taiwan
  

Dr.Chih-Chao Yang
Member
IBM Research 

 

  
Dr. Jianhua Ju
Member
Assistant Director, SMIC Tech R&D
  
Dr. Massayasu Tanjyo
Member
Nissin Ion Equipment, Japan
  
 Dr. Ganming Zhao
Member
Applied Materials
  
Dr. Zheyao Wang
Member
Tsinghua University, China
 

 

Dr. Da Zhang
Member
AMD, USA

 

  

Dr. Larry Zhao
Member
Lam Research, USA

  

Dr. Jiaxiang Nie
Member
Lam Research, China

 

  

 Symposium V: CMP and Post-Polish Cleaning

Dr. Yuchun Wang
Chairman
Anji Microelectronics, China
  
Dr. Kuochun Wu
Co-Chair
Cabot Microelectronics, Asia
  
 Dr. Paul-Chang Lin
Co-Chair
SMIC, China
  
Dr. David Huang
Member
Pall Corporation, USA
  
Dr. Mahadevaiyer Krishnan
Member
IBM, USA
  
Dr. Jin-Goo Park
Member
Hanyang University, Korea
  
 Dr. Kailiang Zhang
Member
Tanjin University of Science & Technology, China
  
 Dr. XinChun Lu
Member
Professor,Tsinghua University , China
  
 Mr. Kent Liu
Member
UMC, Taiwan China
  

Symposium VI: Metrology, Reliability and Testing

Dr. Peilin Song
Chairman
IBM, USA
  

Dr. Baozhen Li
Co-Chair
IBM System and Technology Group, USA

  
 

Dr. Frank Feng
Member
Mentor Graphics Corporation, America

  
Dr. Yuhua Cheng
Member
Peking University, China
  
Dr. Francis Jen
Member
KLA Tencor, China
  
Dr. Kelvin Xia
Member
Verigy, China
  
Dr. Srinivas Raghvendra
Member
Synopsys, USA
  
Dr. Xiaowei Li
Member
Chinese Academy of Sciences
  
Dr. Yu Huang
Member
Mentor Graphics, USA
  
 
  
Dr. Jian-fu Zhang
Member
Liverpool John Moores University, England
  
Dr. Houken Tseng
Member
Teradyne, Greater China,China
  

Symposium VII: Packaging and Assembly

Dr. Steve Liang
Chairman
Jiangsu Changjiang Electronics Technology Co., Ltd, China
  
 Dr. Yifan Guo
Co-Chair
VP of Engineering ,ASE Shanghai
  
 Dr. Huili Fu
Co-Chair
Chief Packaging Expert,HiSilicon
  
 Dr. Wenhui Zhu
Member
Professor,Central South University
  
 Dr.John Rowland
Member
VP of  Engineering,Spreadtrum
  
Dr. Roy Yu
Member
IBM, Watson Research Center, USA
  
Dr. Yishao Lai
Member
ASE. Taiwan, China
  
Dr. Jing Shi
Member
Oracle, USA
  
Dr. Young Do Kweon
Member
Samsung, Korea
  
Prof. Mingliang Huang
Member
Dalian University of Technology, China
  
Dr. Renzhe Zhao
Member
Huawei, China
  
Dr. Mark Huang
Member
SUZHOU SPEED SEMICONDUCTOR, CHINA
  
Dr. Dan Tracy
Member
SEMI, USA
  

Dr. John Yuanlin Xie
Member
Altera Corp., San Jose, CA, USA

 

 

 

Dr. Hong SHI
Member
Xilinx

 

 

Dr. Tim Bao
Member
Air Products and Chemicals

 

  

                               Dr. Tim Chen  
                               Member
                               Yantai Darbond Technology Co., Ltd.

  

Dr. Daniel Lu
Member
Henkel

 

  

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Dr. Qinghuang Lin
Chairman
IBM, USA
  
Dr. Hsiang-Lang Lung
Co-Chair
Macronix International Ltd., Hsinchu, Taiwan
  
 Dr. Hyungjun Kim
Co-Chair
Yonsei University, South Korea
  
Dr. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
 
Dr. Jinn P. Chu
Member
National Taiwan University of Science and Technology, China
  
 
Dr. Daniele Lelmini
Member
Politecnico Di Milano, Italy
Dr. Fuhua Yang
Member
Institute of Semiconductor, Chinese Academy of Sciences, China
 
  Dr. Wang Yueh
Member
Intel, USA
Kangguo Cheng
Member
IBM, USA
 Dr. Thomas Otto
Member
Acting Director of the Fraunhofer Institute for Electronic Nano Systems ENAS Chemnitz, Germany
  Dr. Zheyao Wang
Member
Tsinghua University,China

Symposium IX: Circuit Design, Systems and Applications

Dr. Yiyu Shi
Chair
Assistant Professor, Electrical and Computer Engineering Department, Missouri University of Science and Technolog, USA
  
Dr. Dong Chen
Co-Chair
IBM T.J. Watson Research Center, USA
  
 

Dr. Wenjian Yu
Co-Chair
Associate Professor, Department of Computer Science and Technology, Tsinghua University, China

  
 Dr. Jinjun Xiong
Member,
IBM T.J. Watson Research Center, USA
  
 Mr.  Guanming Huang
Member,
Synopsys Inc, USA
  
 Dr. Pingqiang Zhou
Member
Shanghai Tech University

  
Dr. Masanori Hashimoto
Member
Osaka University, Japan
  
Dr. Tsung-Yi Ho
Member
National Cheng Kung University, Taiwan
  
Dr. Weikang Qian
Member
University of Michigan-Shanghai Jiao Tong University Joint Institute, China
  
 Dr.Haizhou Yin
Member
IME, CAS, China
  
 Dr. Guangyu Sun
Member
Peking University, China
  
 Dr. Zhiru Zhang
Member

Assistant Professor, School of Electrical and Computer Engineering,
Cornell University, USA
  

Symposium X: Si Materials and Photovoltaic Technology

 Prof. Frank  Liu
Chair
Shanxi Normal University, China
  
Dr. David Huang
Co-Chair
Pall Inc,USA

 
  
 

Dr. Qi Wang
Co-Chair
GCL SI

  
 

Dr. Qiang  John
Co-Chair
GCL Executive,China 

  
Dr. Yuepeng Wan
Member
LDK Solar, China
  
 Dr. Liang Wu
Member
GCL Applied Industrial Research Institute Ltd
  
 Dr. Ray Lian
Member
Solabuzz, China
  
Prof. Meng Tao
Member
Arizona State University, USA

 
  
Dr. Zhigang Rick Li
Member
Researcher, DuPont, USA
  

Prof. Paul R. Berger
Member
Ohio State University, USA
 
  

 

Dr. Chris Lv
Member
Trina Solar, China

Contact Us

Kelly Zhang, SEMI China
Tel: 86.21.6027.8556
Fax: 86.21.6027.8511
Email:
 kzhang@semi.org
 
Stacy Zhang, SEMI China
Tel: 86.21.6027.8552
Fax: 86.21.6027.8511
Email:
 szhang@semi.org 

 

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