首页   :    半导体技术大会 :    会议日程

                                                

Plenary Session

CSTIC 2013, Sunday, March 17, 2013
Kerry Hotel, Pudong, Shanghai, China

08:45 – 09:35Opening Ceremony, Grand Shanghai Ballroom 1
 Opening Remarks by Conference Chair
 Opening Remarks by SEMI
 Opening Remarks by ECS
 Opening Remarks by Chinese Government Representatives
 Presentation of  ECS Best Student Paper Awards and SEMI Best Young Engineer Paper Awards
  
09:35 – 10:20

Plenary Lecture, Grand Shanghai Ballroom 1
Prof. Ivar Giaever
Nobel Laureate and Professor of Rensselaer Polytechnic Institute, USA
Discovery of Tunneling between Superconductors

  
10:20 – 10:40Coffee Break
  
10:40 – 11:20
Plenary Lecture, Grand Shanghai Ballroom 1
Dr. Ghavam Shahidi
IBM Fellow and Director of Silicon Technology, IBM Thomas J. Watson Research Center, USA
CMOS Technology Scaling into 2020's: Challenges and Opportunities
  
11:20 – 12:00
Plenary Lecture, Grand Shanghai Ballroom 1
Dr. Peng Bai
Vice President, Technology and Manufacturing Group, Intel, USA
A leading edge 22nm SoC Platform Technology Featuring 3-D Tri-Gate and High-k/Metal Gate Transistors for Low Power, High Performance, and High Density Applications
  
12:00 – 13:30Lunch, Grand Shanghai Ballroom 2
  

Parallel Symposium Oral Sessions

Sunday, March 17, 2013
  
13:30 – 17:00Parallel Symposium Oral Sessions, Pudong Ballroom 1-7 & Function Room 1-4
  
17:00 – 18:30Conference Poster Session, Foyer of Pudong Ballroom
  
Monday, March 18, 2013
  
Symposium II and XI Joint Session: Circuit Design and Lithography, Pudong Ballrooms 2 and 3
Session Chairs: Kafai Lai and Jinjun Xiong
  
08:45-08:50Chairman's opening remarks
  
**8:50-9:20Advanced Technology-Design-Manufacturing Co-optimization for Smart Mobile Devices
Geoffery Yeap, Vice President, Qualcomm, USA
  
**9:20-9:50Lithography opportunities for advanced IC scaling
Mike Rieger, CTO, Synopsys, USA
  
**9:50-10:20Strategies for advanced Mask nodes: Resolution, Process, Cost Reduction
Serder Mannakli, CEO, ASELTA Nanographics, France
  
10:20-10:35Coffee Break
  
Symposium II & III Joint Session: Advanced Patterning Technology, Pudong Ballrooms 2 and 3
Session chairs: Ying Zhang and Kafai Lai
  
**10:35-11:053D Integration
Subu Iyer, IBM Fellow, IBM, USA
  
**11:05-11:35Pattern Formation and Pattern Transfer Strategies for ~10nm Lithography in Magnetic Recording Bit Patterned Media
Ricardo Ruiz, Research Staff Member, HGST, a Western Digital Company, USA
  
**11:35-12:05Directed Self Assembly: Progress in Bottom-Up Lithography
Ralph Dammel, CTO, AZ Electronics Materials, USA
  
08:45 – 17:30Parallel Symposium Oral Sessions, Pudong Ballroom 1-7 & Function Room 1-4
  
Symposium IV & VI Joint Session: Materials and Integrations, Pudong Ballrooms 2 and 3
Session chairs: Zhen Guo and Ran Liu
  
13:30 – 13:35Chairman's opening remarks
  
**13:35 – 14:05Advanced Dielectricss for VLSI Interconnects-State of the Art
Alfred Grill, IBM Fellow, IBM T. J. Watson Research Center, USA
  
**14:05 – 14:35Emerging Memory Devices
H. -S. Philip Wong, Professor, Stanford University, USA
  
**14:35 – 15:05Si Photonics
Mario Panicciam, Intel Fellow, Intel, USA
  
13:30 – 17:30Parallel Symposium Oral Sessions, Pudong Ballroom 1-7 & Function Room 1-4
  

Symposium I: Device Engineering and Technology

Symposium II: Lithography and Patterning

Symposium III: Dry &Wet Etch and Cleaning

Symposium IV: Thin Film Technology

Symposium V: CMP and Post-CMP Cleaning

Symposium VI: Materials and Process Integration for Device and Interconnection

Symposium VII: Packaging and Assembly

Symposium VIII: Metrology, Reliability and Testing

Symposium IX: Emerging Semiconductor Technologies

Symposium X: Advances in MEMS and Sensor Technologies

Symposium XI: Circuit Design, System Integration and Applications
 
Conference Banquet

Sunday, March 17, 2013
  
19:00 – 21:00Conference Banquet, 小南国嘉里店, Kerry Hotel

Kerry Hotel Floor Layout


Click here for full size view

沪ICP备06022522号沪公网安备31011502010679号