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Dr. Seok-Hee Lee
Executive VP and DRAM product development and technology
SK hynix

Seok-Hee Lee received the B.S. and M.S. degrees in Materials Science and Engineering from Seoul National University, Seoul, Korea, in 1988 and 1990, respectively, and the Ph.D. degree in Materials Science and Engineering from Stanford University, Stanford, CA. in 2000.
From 2015, he has become head of DRAM product development and technology as Executive VP in SK hynix after leading their R&D division as Senior VP since February 2013.

From 1990 to 1995, he was with the Advanced Semiconductor Development group, Hyundai Electronics (now SK hynix), Korea, where he worked in the area of gate oxide scaling and reliability. In 1994, he discovered a new breakdown mechanism, “quasi-breakdown (also known as soft-breakdown),” in ultra-thin gate oxide regime.  The research was reported at IEDM94 and has since developed into a new area of study in oxide reliability.  This work has been cited in more than 100 research papers since then.

From 2000 to 2010, he was with the Portland Technology Development group, Intel Corporation, Hillsboro, OR, where he worked on process integration and yield on Intel’s 130-, 90-, and 65-nm advanced CMOS logic technologies. Most recently, he managed a process integration team responsible for developing 32-nm logic process technology.
Dr. Lee has received the Intel Achievement Award three times (Intel’s highest recognition for technical achievement) and 11 Intel Divisional Recognition Awards for his technical achievements in transistor and process development.

From 2010 to 2013, he was with the department of electrical engineering in KAIST, Korea, as an associate professor. His main research was on nano-scale devices and fabrication. Professor Lee received the best teaching award in 2011.

He was a committee member for CMOS devices and technology subcommittee for 2008-2009 IEDM, the chair for the same subcommittee in 2010 IEDM, Asian arrangement chair for 2011 and 2012 IEDM, and emerging technology chair for 2013 IEDM. He is also serving International Conference on Solid State Devices and Materials (SSDM) as a steering committee member for 2011-2014 meetings.

 

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