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Plenary Session

CSTIC 2015,  Sunday, March 15, 2015

SHICC 上海国际会议中心 
中国上海浦东滨江大道2727号

 

08:45 – 09:35Opening Ceremony,
 Opening Remarks by Conference Chair
 Opening Remarks by SEMI
 Opening Remarks by ECS
 Opening Remarks by Chinese Government Representatives
 Presentation of ECS Best Student Paper Awards and SEMI Best Young Engineer Paper Awards
  
Meeting Room3rd Floor Auditorium
  
09:35 – 10:20

 
王曦 教授
中国科学院院士,中国科学院上海微系统技术研究所

  
10:20 – 10:40Coffee Break
  
10:40 – 11:20


Dr. Seok-Hee Lee
Executive VP and DRAM product development and technology, SK Hynix
Scaling challenges and the new era of memory technology

  
11:20 – 12:00

 

 

Rudi Cartuyvels

Senior Vice President, Smart Systems & Energy Technologies, IMEC, Belgium
From Connecting Lives to Improving Lives

  
12:00 – 13:307th Floor Grand Ballroom 1
  

 

Parallel Symposium Oral Sessions 

Sunday,March 15, 2015

  

13:30 – 17:00

Parallel Symposium Oral Sessions,

 

17:00 – 18:30

 

Conference Poster Session,

Monday,March 16,2015

 

8:00-18:00

Parallel Symposium Oral Sessions,
  

  

Joint Sessions

 

Symposium II and Symposium III-Lithograpy/Etch joint session 

Sunday, March 15, 2015

 

Shanghai International Convention Center

Meeting Room: 3H+3I+3J

 

Session Chairs:Kafai Lai (IBM) and Ying Zhang (Applied)

13:30-13:40

Opening Remarks

 Kafai Lai

**13:40-14:10

Making the Smallest Devices Economically using EUV Lithography

Bill Arnold, ASML

**14:10-14:40

 

 

**14:40-15:10

 

 

 **15:10-15:40

Optical Lithography Enabling Evolution of Optical Imaging Theory
Masato Shibuya,Tokyo Polytechnic University

Photomask Technology At 14nm and Beyond

Chris Progler,Photronics

EUV Lithography and 3D IC Technology

Banqiu Wu,AMAT (symp III)

Symposium II and Symposium XI-DTCO Joint session

 

Monday, March 16, 2015

 

Shanghai International Convention Center

Meeting Room: 3H+3I+3J

Session chairs: Kafai Lai/Jinjun Xiong

  

**8:30-9:00

 

Design Technology Co-Development Methodology for 10nm and 7nm Technology Nodes

 

Andrezj Strowjas, PDF Solutions

  
**9:00-9:30

Recent advances in thermal imaging technology
Chongfei Shen, Magnity Electronics (symp XI)

  

*9:30-9:50

Design for Manufacturability and Reliability in Extreme Scaling and Beyond

David Z. Pan,U. of Texas at Austin

  

 

 

Symposium IX and Symposium X Joint Session

 

Monday, March 16, 2015

Shanghai International Convention Center

Meeting Room: 3H+3I+3J

Session Chairs: Qinghuang Lin & Hsiang-Lan Lung

  

**10:00-10:30

Phase Change Memory and its intended Applications
Chung Lam,IBM, USA

 

**10:30-11:00

Stretchable micro-optics

 

Hans Zappe, University of Freiburg, Germany

  

**11:00-11:30

200 mm Wafer-Scale Integration of Sub-20 nm Nanofluidic Chips for Detecting and Controlling Single DNA Molecules
Qinghuang Lin,IBM, USA

  

**11:30-12:00

Phase Change Material and Its Electronic Device

 

Zhitang Song,Shanghai Institute of Microsystem and Information Technology

 


Symposium I: Device Engineering and Technology

Symposium II: Lithography and Patterning

Symposium III: Dry &Wet Etch and Cleaning

Symposium IV: Thin Film Technology

Symposium V: CMP and Post-CMP Cleaning

Symposium VI: Materials and Process Integration for Device and Interconnection

Symposium VII: Packaging and Assembly

Symposium VIII: Metrology, Reliability and Testing

Symposium IX: Emerging Semiconductor Technologies

Symposium X: Advances in MEMS and Sensor Technologies

Symposium XI: Circuit Design, System Integration and Applications

Symposium XII: Si Materials and Photovoltaic Technology
 
 

Conference Banquet

Sunday, March 15, 2015
Banquet fee



800RMB/Person
Online Registration link;
http://223.4.179.170/semi2015/Default.aspx

18:30 – 20:00Conference Banquet, 俏江南正大店(http://www.southbeauty.com/)
上海市浦东新区陆家嘴西路168号正大广场10F



Hotel Floor Layout


 


 

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